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Brand Name : TJIN
Certification : ISO9001
Place of Origin : China
MOQ : 1 set
Delivery Time : 40 days
Packaging Details : Wooden Packing
Capacity : 1000 units/hour
Control System : PLC
Cooling System : Water cooling
Dimensions : 2000mm x 1500mm x 1800mm
Heating Power : 10 kW
Injection Pressure : 200 MPa
Injection Speed : 200 mm/s
Injection Volume : 1000 cc
Material Compatibility : Silicone, Epoxy, Polyurethane
Model : SM-1000
Mold Clamping Force : 100 tons
Operating Temperature : 150-200℃
Power Supply : 220V/50Hz
Automatic Molding Press Machine
Features
● Automatic molding press also known as automatic molding machine, automatic molding chips, semiconductor devices and other products;
● Full servo control system, PLC (Omron) + controller;
● Standardized mold structure, easy to change;
● High efficiency cake loading component, aluminum box loading;
● WIN10 + 15 inch touch screen + touch keyboard;
● CCD image detection, feeding anti-reverse detection;
● Optional mold vacuum function, isolation mold function, detection function after plastic sealing;
Technical Parameters:
Type | Vertical Injection Molding Machine |
Control System | PLC |
Model | SM-1000 |
Cooling System | Water |
Weight | 5 Tons |
Clamping Force | 1000KN |
Capacity | 100 Tons |
Screw Diameter | 35 Mm |
Max. Mold Height | 400Mm |
Injection Pressure | 200 Mpa |
Auto Transfer Molding | Yes |
Auto Packaging Equipment | Yes |
Performance Parameters
● Mold closing pressure: 98-1764kN;
● Injection pressure: 4.9-30kN adjustable;
● Applicable leadframe/substrate size: width 20-90mm, length 100-300mm, thickness 0.15-1.2mm;
● Applicable molding material size: diameter φ 11-20mm, length/diameter 1.2-2.0 (Max 35mm).
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Automatic Semiconductor Molding Press Machine Images |