Sign In | Join Free | My ecer.co.uk
China Guangdong Taijin Semiconductor Technology Co., Ltd logo
Guangdong Taijin Semiconductor Technology Co., Ltd
A manufacturer for semiconductor package equipment include Auto Molding system , Trim & Form singulation System ,Lead frame stamp tools,MGP mold
Verified Supplier

2 Years

Home > Semiconductor Molding Machine >

Automatic Semiconductor Molding Press Machine

Guangdong Taijin Semiconductor Technology Co., Ltd
Trust Seal
Verified Supplier
Credit Check
Supplier Assessment
Contact Now

Automatic Semiconductor Molding Press Machine

  • 1
  • 2
  • 3

Brand Name : TJIN

Certification : ISO9001

Place of Origin : China

MOQ : 1 set

Delivery Time : 40 days

Packaging Details : Wooden Packing

Capacity : 1000 units/hour

Control System : PLC

Cooling System : Water cooling

Dimensions : 2000mm x 1500mm x 1800mm

Heating Power : 10 kW

Injection Pressure : 200 MPa

Injection Speed : 200 mm/s

Injection Volume : 1000 cc

Material Compatibility : Silicone, Epoxy, Polyurethane

Model : SM-1000

Mold Clamping Force : 100 tons

Operating Temperature : 150-200℃

Power Supply : 220V/50Hz

Contact Now

Automatic Molding Press Machine

Features

● Automatic molding press also known as automatic molding machine, automatic molding chips, semiconductor devices and other products;

● Full servo control system, PLC (Omron) + controller;

● Standardized mold structure, easy to change;

● High efficiency cake loading component, aluminum box loading;

● WIN10 + 15 inch touch screen + touch keyboard;

● CCD image detection, feeding anti-reverse detection;

● Optional mold vacuum function, isolation mold function, detection function after plastic sealing;

Technical Parameters:

Type Vertical Injection Molding Machine
Control System PLC
Model SM-1000
Cooling System Water
Weight 5 Tons
Clamping Force 1000KN
Capacity 100 Tons
Screw Diameter 35 Mm
Max. Mold Height 400Mm
Injection Pressure 200 Mpa
Auto Transfer Molding Yes
Auto Packaging Equipment Yes

Performance Parameters

● Mold closing pressure: 98-1764kN;

● Injection pressure: 4.9-30kN adjustable;

● Applicable leadframe/substrate size: width 20-90mm, length 100-300mm, thickness 0.15-1.2mm;

● Applicable molding material size: diameter φ 11-20mm, length/diameter 1.2-2.0 (Max 35mm).


Product Tags:

Semiconductor Molding Press Machine

      

Molding Press semiconductor equipment

      
Quality Automatic Semiconductor Molding Press Machine for sale

Automatic Semiconductor Molding Press Machine Images

Inquiry Cart 0
Send your message to this supplier
 
*From:
*To: Guangdong Taijin Semiconductor Technology Co., Ltd
*Subject:
*Message:
Characters Remaining: (0/3000)