: Guangdong Taijin Semiconductor Technology Co., Ltd

A manufacturer for semiconductor package equipment include Auto Molding system , Trim & Form singulation System ,Lead frame stamp tools,MGP mold

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Water Cooling Steel IC Lead Frame Stamping Mold Hardness HRC50-60

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Semiconductor Molding Machine [25]
Trim And Form Machine [25]
IC Lead Frame Stamping Mold [19]
MGP Mold [30]
Trimming Forming Dies [25]
Mold Chase [6]
Semiconductor Molding Equipment [25]
Chip Sorting Machine [25]

Guangdong Taijin Semiconductor Technology Co., Ltd

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Guangdong Taijin Semiconductor Technology Co., Ltd

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City: Dongguan

Province/State: Guangdong

Country/Region: China

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Water Cooling Steel IC Lead Frame Stamping Mold Hardness HRC50-60

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Water Cooling Steel IC Lead Frame Stamping Mold Hardness HRC50-60

IC Lead Frame Stamping Lead Frame Mold and Hardness HRC 50-60 for IC Lead Frame Stamping Product Description: Features: Product Name: IC Lead Frame Stamping Mold Mold Material: NAK80, S136, SKD61, Etc...

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IC Lead Frame Stamping Mold

Stamping Mold HRC50

Steel IC Lead Frame Mold

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